Rogers RO3003 ceramic-filled PTFE composites + S1000-2M High Tg170 FR-4

Announcing Our New High-Frequency Hybrid PCB Platform

We're excited to introduce a new multi-layer PCB substrate ideal for demanding RF/microwave applications. The platform utilizes both Rogers RO3003 and FR-4 materials to deliver unparalleled performance.

Unrivaled Electrical Properties
With a Dk of 3.0, Df of 0.001 and extremely low CTE of 17 ppm/°C, RO3003 is well-suited for circuits requiring tight spacing and minimal loss up to 77GHz. Its properties are complemented by high-Tg FR-4 cores providing mechanical support.

Optimized 8-Layer Configuration
Our standard stackup features 18μm copper layers and RO3003/FR-4 dielectrics for a total thickness of just 2.2mm. Inner layers utilize 0.5oz copper for routing complexity while outer layers employ 1oz copper.

Advanced Manufacturing Expertise
Using our blind via expertise and immersion gold finishes, we can reliably produce designs up to IPC Class 2 tolerances. In-house testing ensures 100% electrical compliance.

Wide Range of Applications
This platform is ideal for use in filters, oscillators, antennas and other thermal-sensitive designs from DC to Ku-band. Its versatility also supports hybrid circuit concepts.

Proven Performance
With temperature ratings from -40°C to +85°C, this substrate provides robust, consistent electrical behavior essential for mission-critical systems.

Start Designing Today

Please contact our sales representative Sally for pricing, lead times and any technical support needed to take full advantage of this cutting-edge material platform. We look forward to helping optimize your high-frequency designs.

Rogers RO3003 ceramic-filled PTFE composites + S1000-2M High Tg170 FR-4 Images