10-Layer Custom PCB with RO3003 Core and FR-28 Prepreg
This custom-designed 10-layer PCB is engineered for high-frequency applications and built using advanced materials to ensure optimal performance. The PCB incorporates 5 pieces of RO3003 laminate core, laminated with FR-28 prepreg, providing a combination of exceptional electrical properties, thermal reliability, and robust mechanical characteristics. Designed with 1oz finished copper per layer and a total lamination thickness of 1.66mm, this board meets the needs of demanding RF and microwave applications.
Key Specifications
| Parameter |
Details |
| Layers |
10 |
| Core Material |
RO3003 |
| Prepreg Material |
FR-28 |
| Copper Weight |
1oz per layer |
| Total Thickness |
1.66mm |
| Dimensions |
75mm x 63mm |
| Surface Finish |
Immersion gold |
| Via Configuration |
Blind vias: Layers L7-L10 and L9-L10 |
| Solder Mask |
None |
| Markings |
None |
RO3003 Core Material
The RO3003 board material, manufactured by Rogers Corporation, is a ceramic-filled PTFE laminate widely recognized for its stable electrical and mechanical properties. It is designed to deliver low-loss signal transmission and consistent impedance control, making it ideal for high-frequency circuits.
| RO3003 Properties |
Details |
| Dielectric Constant (Dk) |
3.00 ± 0.04 at 10 GHz |
| Dissipation Factor (Df) |
0.0013 at 10 GHz |
| CTE (X/Y-Axis) |
17 ppm/°C |
| CTE (Z-Axis) |
24 ppm/°C |
| Thermal Stability |
High, with minimal etch shrinkage (<0.5 mils/inch) |
| Applications |
RF/microwave designs, multilayer PCBs |
RO3003’s low dissipation factor ensures minimal signal loss, while its dimensional stability and plated-through-hole (PTH) reliability make it suitable for multilayer designs. This material supports blind vias effectively, as implemented in this PCB design.
FR-28 Prepreg
The FR-28 prepreg acts as the bonding material between the RO3003 core layers. This high-performance thermosetting resin is reinforced with fiberglass and is specifically designed for low-loss and high-layer-count PCBs. It complements the RO3003 material, ensuring reliable lamination and excellent electrical properties.
| FR-28 Properties |
Details |
| Dielectric Constant (Dk) |
2.77 at 10 GHz |
| Dissipation Factor (Df) |
0.0015 at 10 GHz |
| Glass Transition (Tg) |
188°C |
| Thermal Conductivity |
0.25 W/m*K |
| CTE (X/Y/Z-Axis) |
X: 59 ppm/°C, Y: 70 ppm/°C, Z: 72 ppm/°C |
| Flow Properties |
High resin content, strong void-free bonding |
FR-28 prepreg’s low flow properties ensure effective bonding during lamination without risk of unwanted resin flow into cavities. Its high thermal stability reduces the risk of delamination or warping, making it suitable for multilayer constructions like this 10-layer PCB.
Applications
This custom PCB is ideal for applications in RF and microwave systems, high-speed data transmission, and telecommunications hardware, where low-loss, high-reliability performance is essential. The combination of RO3003 cores and FR-28 prepreg ensures excellent signal integrity, mechanical durability, and thermal stability.
Summary Table
| Feature |
Benefit |
| RO3003 Core |
Low-loss, high-frequency performance |
| FR-28 Prepreg |
Reliable lamination and high thermal stability |
| 10 Layers with Blind Vias |
Multilayer interconnection and compact design |
| Immersion Gold Finish |
Superior solderability and corrosion resistance |
| Dimensions |
Compact 75mm x 63mm design |
| No Solder Mask/Markings |
Simplified design for specialized applications |
By leveraging these advanced materials and configurations, this PCB ensures optimal performance in even the most demanding environments, making it an excellent choice for aerospace, telecommunications, and high-speed electronic designs.
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RO3003 10-Layer Custom PCB laminate Core and FR-28 Prepreg 1.66mm with1oz copper and pure gold Images
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