30mil RT/duroid 6035HTC 2-Layer PCB with Immersion Silver Finish
The 30mil RT/duroid 6035HTC 2-Layer PCB is a high-performance printed circuit board designed for high-power RF and microwave applications. Constructed with Rogers RT/duroid 6035HTC laminates, this PCB offers exceptional thermal conductivity, low insertion loss, and outstanding high-frequency performance. The Immersion Silver surface finish ensures excellent solderability, making this PCB ideal for power amplifiers, couplers, filters, and other high-power applications.
PCB Construction Details
| Specification |
Details |
| Base Material |
RT/duroid 6035HTC |
| Layer Count |
2-layer rigid PCB |
| Board Dimensions |
87mm x 96.5mm ± 0.15mm |
| Finished Thickness |
0.85mm |
| Copper Thickness |
1oz (35μm) on both layers |
| Surface Finish |
Immersion Silver |
| Minimum Trace/Space |
5/6 mils |
| Minimum Hole Size |
0.2mm |
| Via Plating Thickness |
20μm |
| Top Solder Mask |
Blue |
| Bottom Solder Mask |
None |
| Silkscreen |
White (Top Only) |
| Electrical Testing |
100% prior to shipment |
| Quality Standard |
IPC-Class-2 |
PCB Stackup
| Layer |
Material |
Thickness |
| Copper Layer 1 |
Copper Foil (1oz) |
35μm |
| Core |
RT/duroid 6035HTC (30mil) |
0.762mm |
| Copper Layer 2 |
Copper Foil (1oz) |
35μm |
PCB Statistics
| Parameter |
Value |
| Components |
31 |
| Total Pads |
104 |
| Thru-Hole Pads |
73 |
| Top SMT Pads |
31 |
| Bottom SMT Pads |
0 |
| Vias |
86 |
| Nets |
2 |
The PCB is designed using Gerber RS-274-X artwork, ensuring precise fabrication and easy integration into modern manufacturing processes.
Material Overview: Rogers RT/duroid 6035HTC
RT/duroid 6035HTC is a high-frequency circuit material designed for use in high-power RF and microwave applications. It features a ceramic-filled PTFE composite with superior thermal conductivity and excellent dielectric properties. The laminates are easily processable with standard FR-4 manufacturing techniques, making them cost-effective for complex high-power designs.
| Property |
Value |
| Dielectric Constant (Dk) |
3.5 ± 0.05 at 10GHz/23°C |
| Dissipation Factor (Df) |
0.0013 at 10GHz/23°C |
| Thermal Conductivity |
1.44 W/mK at 80°C |
| CTE (X/Y/Z) |
19ppm/°C, 19ppm/°C, 39ppm/°C |
| Moisture Absorption |
0.06% |
| Operating Temperature |
-55°C to +288°C |
| Flammability |
UL 94 V-0 |
The high thermal conductivity (1.44 W/mK) ensures efficient heat dissipation, reducing operating temperatures in high-power applications.
Key Features:
- Dielectric Constant (Dk): 3.5 ± 0.05 for predictable and consistent signal performance.
- Low Dissipation Factor (Df): 0.0013 at 10GHz for minimal signal loss in high-frequency applications.
- High Thermal Conductivity: 1.44 W/mK for efficient heat dissipation in high-power circuits.
- Moisture Resistance: Low moisture absorption (0.06%) ensures stable performance in varying environmental conditions.
- Immersion Silver Finish: Provides excellent solderability, corrosion resistance, and high conductivity.
Key Benefits:
- Improved Heat Dissipation: Enables lower operating temperatures, increasing circuit reliability and lifespan.
- Low Insertion Loss: Ensures superior signal integrity in RF and microwave designs.
- Cost-Effective Manufacturing: Compatible with standard FR-4 processes, reducing fabrication costs.
- Environmentally Friendly: RoHS compliant and lead-free.
- High Durability: Excellent thermal stability and resistance to conductive anodic filament (CAF) formation ensure long-term reliability.
Applications
High-power RF amplifiers and power dividers
Couplers, filters, and combiners
High-frequency power amplifiers
Microwave filters and combiners
High-power RF modules and antenna systems
Conclusion
The 30mil RT/duroid 6035HTC 2-Layer PCB with Immersion Silver Finish is a high-performance solution for RF and microwave applications requiring superior thermal conductivity, low dielectric loss, and excellent signal integrity. With its Rogers RT/duroid 6035HTC laminates, this PCB offers exceptional heat dissipation and reliable high-frequency performance, making it ideal for demanding high-power designs. The Immersion Silver finish ensures excellent solderability and long-term reliability. With worldwide availability and compliance with IPC-Class-2 standards, this PCB is a reliable and efficient choice for high-power RF and microwave system designs.
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30mil RT/duroid 6035HTC 2-Layer PCB with Immersion Silver Finish Images
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