2-Layer TP1600 PCB | 0.8mm Core | Pure Gold Plating
Product Overview
We are pleased to present this newly customized 2-layer rigid PCB built on Wangling's TP1600 high-performance microwave composite dielectric laminate. As a specialized member of the TP series, this material features a ceramic-filled polyphenylene oxide (PPO) resin matrix with no fiberglass reinforcement, offering a uniquely smooth surface and uniform electrical performance.
The board measures 75mm x 68mm (single piece) with a finished thickness of 0.9mm (including 0.8mm core + 2 x 35μm copper) and dimensional tolerance of ±0.15mm. Minimum trace and space are 4/6 mils (finer than typical RF designs), with a minimum finished hole size of 0.2mm. No blind vias are used in this construction.
This design features green solder mask on both sides for circuit protection and insulation, along with white silkscreen on both sides for clear component identification. The Pure Gold Plating surface finish provides an ultra-flat, corrosion-resistant surface with excellent solderability and wire bondability, making it ideal for high-reliability applications. Every board undergoes 100% electrical testing prior to shipment and conforms to IPC-Class-2 quality standards. Gerber files are supplied in RS-274-X format, and worldwide shipping is available.
PCB General Specifications
| Parameter | Detail |
| Layer Count | 2-Layer Rigid |
| Base Material | TP1600 (Ceramic-filled PPO, no fiberglass, ED copper) |
| Board Dimensions | 75mm x 68mm (1 PCB) ±0.15mm |
| Finished Thickness | 0.9mm |
| Core Thickness | 0.8mm (31.49 mils) |
| Min. Trace / Space | 4 / 6 mils |
| Min. Hole Size | 0.2mm |
| Blind Vias | None |
| Finished Cu Weight | 1 oz (1.4 mils / 35μm) outer layers |
| Via Plating Thickness | 20 μm |
| Surface Finish | Pure Gold Plating |
| Top Solder Mask | Green |
| Bottom Solder Mask | Green |
| Top Silkscreen | White |
| Bottom Silkscreen | White |
| Electrical Test | 100% prior to shipment |
| Artwork Format | Gerber RS-274-X |
| Quality Standard | IPC-Class-2 |
| Availability | Worldwide |
| Components / Pads / Vias / Nets | 34 / 56 / 34 / 2 |
Material Advantages: TP1600
The TP1600 is a specialized high-frequency microwave composite dielectric copper-clad laminate (CCL) from Taizhou Wangling Insulation Material Factory. The model number directly indicates its nominal dielectric constant of 16.0. The dielectric constant is precisely adjusted by modifying the ratio of ceramic to PPO resin, with the production process offering excellent dielectric properties and high reliability.
Key material highlights:
No fiberglass reinforcement – eliminates glass weave effects on electromagnetic wave propagation, providing a smooth surface and uniform electrical performance
High Dk (16.0 ±0.32) – enables significant circuit size reduction for compact antennas and resonant structures
Ultra-low dissipation factor (0.0012 at 5GHz) – minimal loss variation up to 10 GHz
Excellent low-temperature performance – long-term operating temperature from -100°C to +150°C
Radiation-resistant & low outgassing – ideal for aerospace, satellite, and applications
Easier machining than pure ceramics – can be drilled, turned, ground, sheared, and etched
Critical Processing Notes:
No wave soldering – material is not suitable for 260°C thermal shock testing
Reflow soldering max temperature ≤ 200°C – standard reflow profiles may cause deformation or copper delamination
Hand soldering recommended – use constant-temperature soldering iron
Multilayer processing not generally recommended – if necessary, use low-temperature bonding sheets and conduct thorough feasibility review
The TP series includes TP (unclad, smooth surface), TP-1 (single-sided copper), and TP-2 (double-sided copper). TP1600 is the double-sided copper version with 1 oz ED copper foil.
TP1600 Material Properties
| Property | Test Condition | Value | Benefit |
| Dielectric Constant (Dk) | 5 GHz | 16.0 ±0.4 (±2.5%) | High Dk enables circuit size reduction |
| Dissipation Factor (Df) | 5 GHz | 0.0012 | Ultra-low loss at microwave frequencies |
| TCDk (Temperature Coefficient of Dk) | -55°C to +150°C | -40 ppm/°C | Stable performance across temperature |
| Peel Strength (1 oz, normal) | Normal condition | >0.6 N/mm | Reliable copper adhesion |
| Peel Strength (1 oz, after humidity) | After damp heat | >0.4 N/mm | Maintains adhesion in humid environments |
| Volume Resistivity | Normal condition, 500V | >1×10⁹ MΩ·cm | High insulation resistance |
| Surface Resistivity | Normal condition, 500V | >1×10⁷ MΩ | Clean signal integrity |
| CTE (X-axis) | -55°C to +150°C | 40 ppm/°C | Dimensional stability |
| CTE (Y-axis) | -55°C to +150°C | 40 ppm/°C | Dimensional stability |
| CTE (Z-axis) | -55°C to +150°C | 50 ppm/°C | Reliable PTH performance |
| Thermal Conductivity | – | 0.80 W/(m·K) | Good heat dissipation for high Dk material |
| Density | – | 2.76 g/cm³ | High ceramic content |
| Moisture Absorption | 20±2°C, 24 hours | ≤0.01% | Extremely low, ideal for aerospace |
| Long-term Operating Temperature | – | -100°C to +150°C | Wide operational range, excellent low-temp performance |
| Material Composition | – | PPO + ceramic + ED copper | Unique thermoplastic RF substrate |
PCB Stackup & Construction
The board features a 2-layer stackup:
Top Copper (Layer 1): 1 oz (35μm) – ED copper foil
Dielectric Core: TP1600 – 0.8mm (31.49 mils)
Bottom Copper (Layer 2): 1 oz (35μm) – ED copper foil
Total Finished Thickness: 0.9mm
Minimum trace and space are 4/6 mils, with a minimum finished hole size of 0.2mm. Via plating thickness is 20μm, and no blind vias are used. The design supports 34 components, 56 total pads (29 thru-hole, 27 top SMT), 34 vias, and 2 nets.
The green solder mask on both sides provides circuit protection and insulation, while the white silkscreen on both sides enables clear component identification.
Typical Applications
Thanks to its high Dk (16.0), ultra-low loss (0.0012), and excellent reliability, this PCB is ideally suited for:
Miniaturized antennas – Beidou navigation, compact RF systems
RF/microwave filters, couplers, and resonant cavities
Aerospace and defense electronics – missile-borne systems, fuzes
Satellite payloads and navigation systems
High-frequency sensor modules requiring stable high-Dk performance
Phase-sensitive electronic structures
Available Configurations
TP1600 is available with ED copper foil in thicknesses of 0.018mm and 0.035mm (1 oz). Standard panel sizes include 150×150mm, 160×160mm, 200×200mm, and 170×240mm, with custom dimensions available upon request. Thickness options range from 0.8mm to 12.0mm with corresponding tolerances.
For applications requiring shielding or enhanced heat dissipation, the TP series can also be supplied with aluminum or copper backing (contact our sales team for availability).
All PCBs are 100% electrically tested and shipped with a Certificate of Conformance per IPC-6012. Please note the special processing requirements for TP1600 (no wave soldering, reflow ≤200°C). For Gerber review, stackup confirmation, or volume pricing, please contact our technical sales team.
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High DK value 16 2-Layer TP1600 ceramic-filled PPO PCB | 0.8mm dielectric laminate | Pure Gold Plating Images
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